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Samsung's profit more than doubles as AI chip demand explodes

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Samsung's profit more than doubles as AI chip demand explodes

Samsung Electronics reported a significant Q3 earnings rebound, with operating profit more than doubling quarter-over-quarter to 12.2 trillion KRW, largely exceeding analyst estimates. This strong performance was primarily fueled by surging global demand for high-bandwidth memory (HBM) chips essential for AI servers, leading to a tenfold increase in its semiconductor division's operating profit from the prior quarter. The company's shares rose nearly 4% as it demonstrated progress in the competitive HBM market, including passing Nvidia's qualification tests, and also saw robust sales in its mobile division, indicating broad strength driven by AI sector expansion.

Analysis

Samsung Electronics reported a robust Q3 operating profit of 12.2 trillion Korean won, significantly exceeding analyst estimates of 11.25 trillion won and more than doubling from the previous quarter. This strong performance, which led to a nearly 4% surge in shares, was primarily fueled by surging global demand for high-bandwidth memory (HBM) chips critical for artificial intelligence servers, with overall revenue reaching 86.1 trillion won. The semiconductor division was the primary growth driver, achieving a tenfold increase in operating profit quarter-over-quarter and an 81% year-over-year rise to 7.0 trillion won, on revenue of 33.1 trillion won. Samsung's success in the HBM market, where it recorded all-time high quarterly sales, is notable, especially as it reportedly passed Nvidia's qualification tests for an advanced HBM chip, signaling a closing gap with rival SK Hynix and reclaiming the top spot in the overall memory market. Beyond semiconductors, Samsung's mobile and network businesses also demonstrated strength, posting a 28% year-over-year increase in operating profit to 3.6 trillion won, attributed to strong flagship smartphone sales. The company anticipates the rapid expansion of the AI industry will continue to create significant opportunities across both its device and chip segments, with plans to mass produce HBM4 technology by 2026, underscoring an optimistic forward outlook.

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