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Chip cooling startup Corintis raises $24 million, adds Intel CEO Lip-Bu Tan to board

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Chip cooling startup Corintis raises $24 million, adds Intel CEO Lip-Bu Tan to board

Corintis, a Swiss startup specializing in advanced liquid chip-cooling technology, has secured $24 million in Series A funding, valuing the company at approximately $400 million, to meet the surging demand for efficient heat management in AI semiconductors. The company's system, which channels liquid directly inside chips for superior cooling, has demonstrated up to three times greater efficiency than standard methods in tests by Microsoft. The capital infusion will enable Corintis to expand its team, significantly scale manufacturing from 100,000 to 1 million cold plates annually, and establish a U.S. presence, with Intel CEO Lip-Bu Tan notably joining its board, underscoring the strategic importance of its innovation for high-performance computing infrastructure.

Analysis

Corintis, a Swiss startup, has secured $24 million in a Series A funding round, achieving an approximate valuation of $400 million and validating its critical role in the AI hardware ecosystem. The company's unique liquid chip-cooling technology, which channels liquid directly inside semiconductors, has demonstrated up to three times greater efficiency than standard methods in tests with key customer Microsoft (MSFT). This technological advantage directly addresses the thermal management bottleneck created by power-intensive AI accelerators from firms like Nvidia (NVDA). The strategic appointment of Intel (INTC) CEO Lip-Bu Tan to the board, alongside a former CEO of cooling firm CoolIT, provides significant industry validation and strategic guidance. With the new capital, Corintis plans an aggressive expansion, aiming to scale up manufacturing of its cold plates tenfold to 1 million units annually and establish a U.S. presence, positioning itself as a key enabler for the next generation of high-density data centers.

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