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Chip cooling startup Corintis raises $24 million, adds Intel CEO Lip-Bu Tan to board

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Chip cooling startup Corintis raises $24 million, adds Intel CEO Lip-Bu Tan to board

Corintis, a Swiss startup specializing in advanced liquid chip-cooling technology, has secured $24 million in Series A funding, valuing the company at approximately $400 million, to address the escalating heat management challenges posed by high-power AI chips. Its proprietary system, which channels liquid directly inside chips for superior efficiency (up to three times better than standard methods per Microsoft tests), is critical for scaling AI infrastructure and mitigating strain on power grids. The funding, coupled with Intel CEO Lip-Bu Tan joining its board, will enable Corintis to significantly ramp up cold plate production and expand into the U.S. market, highlighting growing institutional validation for innovative cooling solutions in the AI sector.

Analysis

Corintis, a Swiss startup specializing in liquid chip-cooling, has secured $24 million in Series A funding at an approximate $400 million valuation, signaling strong investor confidence in solutions addressing the thermal challenges of high-power AI semiconductors. The technology's validation comes from a key customer, Microsoft, whose tests indicate Corintis's system is up to three times more efficient than standard methods by channeling liquid directly inside the chip. This technical advantage is critical as firms like Nvidia produce increasingly power-intensive chips that strain traditional data center cooling and power infrastructure. The strategic importance of Corintis is further underscored by the addition of prominent industry figures to its board, including Lip-Bu Tan (noted in the article as Intel CEO) and Geoff Lyon, founder of liquid-cooling firm CoolIT. With the new capital, Corintis plans an aggressive expansion, aiming to increase its cold plate production tenfold to 1 million units annually next year and establish a presence in the U.S. market, positioning it as a key enabler for the next generation of AI hardware deployment.

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