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Banks Eye $21 Billion of Bonds For Broadcom Chip-Financing Deal
Source: Bloomberg
Artificial IntelligenceCredit & Bond MarketsBanking & LiquidityTechnology & Innovation
Banks plan to sell up to about $21 billion of high-grade bonds as soon as early next year, as part of a $63 billion funding package assembled by Broadcom to help finance chips for AI developer Anthropic. The report describes planned financing and does not provide further terms or market reaction.
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