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Taiyo Holdings Launches Next-generation Semiconductor-packaging Material "FPIM Series," Achieving Its First Three-layer RDL Formation with 700-nm CD on 12-inch Wafers
Source: PR Newswire
Technology & Innovation
Taiyo Holdings announced that it presented a paper at IEEE ESTC 2026, a conference focused on semiconductor and electronic-device packaging technologies and materials. The available article text contains no financial results, product commercialization details, guidance, or quantified business impact.
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