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DayOne In Early Talks With Banks for Potential $500 Million Bond

Source: Bloomberg

Artificial IntelligenceCredit & Bond MarketsCompany Fundamentals

DayOne Data Centers has held preliminary talks with banks for weeks about a potential $500 million bond offering, according to people familiar with the matter. The Singapore-based company is increasing fundraising as demand for AI infrastructure grows; no offering terms or completion were reported.

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