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Taiwan breaks ground on advanced packaging park anchored by TSMC

Source: reuters.com

Technology & InnovationInfrastructure & DefenseCompany Fundamentals
Taiwan breaks ground on advanced packaging park anchored by TSMC

Taiwan broke ground on an advanced semiconductor-packaging industrial park in Kaohsiung. TSMC plans to establish technology-validation and talent-training facilities at the site, supporting development of the domestic advanced-packaging ecosystem and semiconductor workforce.

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