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Arteris, 업계의 Multi-Die 칩렛 기반 아키텍처 전환 가속화
Source: GlobeNewswire
Technology & InnovationProduct LaunchesCompany Fundamentals
The company expanded its solution portfolio with a new FlexGen Multi-Die product aimed at semiconductor customers transitioning to multi-die architectures. The offering is positioned to improve data-movement efficiency while preserving quality-of-service (QoS) and architectural flexibility across chip boundaries. No financial metrics, customer wins, or guidance changes were disclosed.
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